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Prepare
Site
Solder removed with blade and socket wick. Site cleaned
with solvent. |
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Begin
with Pasted BGA
BGA Component has been aligned on pasted pads. |
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Vacuum
Pick-Up.
Micro Placer system picks up the component and suspends
above prism for alignment. |
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Align
Align Component stencil with PC Board land pattern |
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Lower
Nozzle
Reflow component in Micro Oven or beneath FCR/MTR rework nozzle. |
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Align
High Resolution corner overlay allows easy alignment at up to 50X
magnification (80x for CSP systems) |
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Paste
Apply paste with metal squeegee. If desired, pattern can be inspected
with micro placer. |
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Reflow.
Micro Oven accurately duplicates original profile with uniform
temperature across entire component. |
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Remove
Stencil
Easy-to-use actuator allows clean stencil snap-off. |
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Place
Component
The BGA or fine pitch component is accurately places with automatic
vacuum release. |
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Process
Completed!
Proper process control provides reliable solder joints with maintaining
integrity of component, board, and adjacent components. |
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