DPA
Engineering has been assembling Ball Grid Array (BGA) and Micro
BGA for the last several years despite the fact that for many
it is still an emerging technology. The two keys for successful
implementations of BGA are:
Because
DPA Engineering has invested in the specialized BGA equipment,
and has highly trained specialists in BGA Technology, DPA is the
preferred choice on both counts.
DPA
Engineering
is one of the few companies that has invested in the highly
specialized equipment required for BGA and Micro BGA assembly
and production.
Perhaps
one of the toughest challenges is the removal and replacement
of BGA devices from a board. This typically occurs during the
development phase of a new product. The rework of an array package
requires process control and repeatability to replicate the original
assembly thermal process.
DPA
Engineering has solved this problem by dedicating an entire rework
station specifically for this process, which allows local removal
of devices without damaging the PCB or the device itself, and
then using real-time thermal profiling.
With
the capability of in-house X-ray inspection, DPA Engineering is
able to provide 24 hours quick turn on BGA placement and rework
at competitive prices.
